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Foxconn has set up a joint speculation with Amerindic IT behemoth HCL Group to found its semiconductor unit packaging and testing operations in India , as the Apple manufacture partner look to boom its presence in the South Asian nation to reduce reliance on China .

As a part of the deal , Foxconn Hon Hai Technology India Mega Development , a subsidiary of the Taiwanese company , will induct $ 37.2 million for a 40 % stake , it disclose in a stock certificate exchange filing .

This will be Foxconn ’s first investiture toward arrange up Outsourced Semiconductor Assembly And Test ( OSAT ) operation in India . The party has committed to putting billions of one dollar bill into the country to bolster its domestic manufacturing for customers , including Apple and Xiaomi .

“ Foxconn looks onwards to together with coiffe up OSAT performance in India with HCL . Through this investment , the partners aim to construct an ecosystem and foster supplying chain of mountains resilience for the domesticated industry . Foxconn will deploy its BOL , or build - operate - localize , example to endorse local communities , ” the Formosan company say in a statement to TechCrunch .

In November last class , Foxconn announced its plans toinvest $ 1.5 billionin India to fulfil its “ operational needs . ” The company alsopartnered with local pudding stone Vedantato sic up a $ 20 billion semiconductor unit in the Indian state of Gujarat . However , it eventually pulled out of the deal in July whilecommitting to “ actively reviewing the landscape for optimum partners . ”

The maker also submitted a sweet software to start its semiconductor equipment fabrication unit in the country later in the year , Deputy IT Minister Rajeev Chandrasekhar said in the fantan .

“ HCL Group has a solid engine room and fabrication heritage and this is an opportunity that provides strategic adjacency to the Group portfolio . This is line with Government of India ’s vision of ‘ Make in India ’ and ‘ Atmanirbhar Bharat ’ also , ” an HCL Group spokesperson say .

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